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標(biāo)準(zhǔn)去膠規(guī)格

Ash Rate: ≥ 5.0μm/min

Non Unif Across Wafer:  ≤5% 

Based on 1.2 μm PR / 3mm from EBR

Non Unif Wafer to Wafer, Head-to-Head: ≤5%

Particles: ≤ 0.04 Particles/cm2 @ >0.2μm

生產(chǎn)效率規(guī)格

Productivity Specification

Uptime: > 95%

MTBF: > 400 hrs

MTTR: < 4 hrs

Throughput：130pcs/hr

Wafer Breakage: < 1 in 20Kwfrs

Average System Installation Time: < 2 weeks(from move-in time to process qualification)

特定  

High strip rateμ(> 5μm/min)

Loadlocked design

Multiple process stations (4 max)